IoT & Hardware Engineering USA | Embedded Systems & PCB Design
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IoT & Hardware Engineering Services in USA | FCC Certified Development
Big0 delivers cutting-edge IoT and hardware engineering solutions for American manufacturers, industrial operations, and technology innovators. Our expertise spans embedded systems development, PCB design, firmware engineering, wireless connectivity, and regulatory compliance including FCC certification, UL safety testing, and industry-specific standards.
We serve clients across major US manufacturing and technology hubs including Silicon Valley's electronics heritage, Austin's semiconductor industry, Boston's robotics innovation, Seattle's aerospace sector, and the Midwest manufacturing belt. Our solutions drive Industry 4.0 transformation, smart city initiatives, and next-generation consumer IoT products.
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Get Started TodayFCC Certification & Regulatory Compliance
FCC Part 15 Certification (Unintentional Radiators) FCC Part 15 Subpart B compliance for digital devices emitting radio frequency energy unintentionally (computers, monitors, industrial equipment). Testing for radiated and conducted emissions ensuring devices don't cause harmful interference. Required for any electronic device marketed in USA. Testing at accredited labs (Intertek, UL, TÜV) with FCC ID or Supplier's Declaration of Conformity (SDoC).
FCC Part 15 (Intentional Radiators) - Wireless Devices Certification for wireless devices including WiFi, Bluetooth, Zigbee, LoRa, and proprietary wireless protocols. FCC Part 15.247 (spread spectrum), 15.249 (unlicensed PCS), and 15.407 (U-NII bands for WiFi). Requires FCC ID from certified test lab documenting compliance with power limits, bandwidth restrictions, and spurious emissions.
FCC Part 18 (Industrial, Scientific, Medical Equipment) Specialized certification for ISM equipment operating at specific frequencies (915 MHz, 2.4 GHz, 5.8 GHz) including microwave ovens, RF heating equipment, medical diathermy, and industrial heating. Higher power levels permitted than Part 15 but stricter shielding and interference mitigation required.
Cellular Device Certification (FCC Part 22, 24, 27) Certification for cellular IoT devices using LTE Cat-M1, NB-IoT, or 5G connectivity. Compliance with carrier requirements (AT&T, Verizon, T-Mobile certification programs) in addition to FCC. PTCRB certification for GSM/LTE devices ensuring network compatibility and performance standards.
UL Safety Certification UL (Underwriters Laboratories) safety certification for electrical products ensuring fire and shock hazard protection. UL 60950-1 for IT equipment, UL 2089 for IoT devices, UL 2900 for cybersecurity of network-connectable products. Required by many retailers, insurance companies, and for government procurement.
Industry-Specific Certifications - CE Marking: For devices also sold in Europe (often pursued simultaneously with FCC) - NEMA Ratings: Enclosure protection for industrial environments (NEMA 1-13) - IP Ratings: Ingress Protection for dust and water resistance (IP65, IP67, IP68) - Hazardous Location: Class I, II, III Division certifications for explosive atmospheres - Medical Devices: FDA registration and IEC 60601 for medical electrical equipment
Embedded Systems Development
ARM Cortex Microcontroller Development Embedded firmware for ARM Cortex-M series microcontrollers (M0, M3, M4, M7) popular in IoT applications. Development using STM32 (STMicroelectronics), NXP i.MX RT, TI Sitara, and Microchip SAM families. Real-time operating systems (FreeRTOS, Zephyr, ThreadX) for multitasking and resource management.
Linux Embedded Systems (Yocto, Buildroot) Custom Linux distributions for embedded applications using Yocto Project or Buildroot. System-on-Module (SoM) integration with Raspberry Pi Compute Module, NVIDIA Jetson (for AI/ML edge applications), BeagleBone, and industrial modules. U-Boot bootloader, device tree configuration, and kernel customization.
Real-Time Operating Systems (RTOS) Implementation of deterministic real-time systems for time-critical applications. FreeRTOS (open source, widely adopted), Zephyr RTOS (Linux Foundation, IoT-optimized), Azure RTOS (Microsoft, safety-certified), and VxWorks (Wind River, aerospace/defense). Task scheduling, inter-process communication, and hardware abstraction layers.
Low-Power & Battery-Operated Devices Ultra-low-power design for battery-operated IoT devices targeting multi-year battery life. Sleep mode optimization, energy harvesting integration (solar, RF, vibration), and efficient power management. Battery selection (lithium primary, rechargeable Li-ion, NiMH) and charging circuit design.
PCB Design & Manufacturing
Multi-Layer PCB Design (4-16+ Layers) Professional PCB layout using Altium Designer, KiCad, or Eagle CAD. High-speed signal integrity analysis, controlled impedance traces for RF/high-speed digital, and thermal management. Stack-up design for 4, 6, 8+ layer boards optimizing signal, power, and ground planes.
RF & Antenna Design Specialized RF PCB layout for wireless devices including impedance matching, transmission line design, and antenna integration. PCB antenna design (inverted-F, patch, meandered), external antenna connectors (U.FL, SMA), and antenna tuning. RF shielding and grounding techniques minimizing interference.
High-Speed Digital Design Signal integrity for high-speed interfaces: USB 3.0/3.1, PCIe, HDMI, DisplayPort, Gigabit Ethernet, and DDR4/DDR5 memory. Differential pair routing, length matching, via optimization, and return path continuity. Simulation using HyperLynx or Ansys for pre-layout verification.
USA-Based PCB Manufacturing Domestic PCB fabrication partnerships with US manufacturers (Advanced Circuits, Sunstone Circuits, RUSH PCB, PCB Universe) for ITAR compliance, faster prototyping, and quality control. Quick-turn prototypes (24-48 hours) and production runs. Alternative Asia manufacturing (China, Taiwan) for cost optimization on high-volume products.
PCB Assembly & Contract Manufacturing Full turnkey assembly services including component sourcing, SMT/through-hole assembly, automated optical inspection (AOI), X-ray inspection, and functional testing. USA contract manufacturers (Flex, Benchmark Electronics, Sanmina, Plexus) for production volumes 100-1M+ units. PCBA cost optimization through DFM (Design for Manufacturing) reviews.
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Get Started TodayWireless Connectivity & Protocols
Cellular IoT: Cat-M1, NB-IoT, 5G Integration with US cellular networks for wide-area IoT connectivity. LTE Cat-M1 (up to 1 Mbps) and NB-IoT (narrowband) for low-power, low-bandwidth applications—asset tracking, smart meters, environmental sensors. Carrier partnerships with AT&T IoT, Verizon ThingSpace, and T-Mobile IoT. 5G IoT for high-bandwidth, low-latency applications (industrial automation, autonomous vehicles).
WiFi 6 & WiFi 6E Integration Latest WiFi standards providing improved performance in dense environments. WiFi 6 (802.11ax) with OFDMA and MU-MIMO for smart buildings and industrial IoT. WiFi 6E utilizing 6 GHz band (FCC approved 2020) for interference-free connectivity. Module integration from Espressif (ESP32), Qualcomm, and Broadcom.
Bluetooth Low Energy (BLE) & Bluetooth 5.x BLE for short-range, low-power applications: wearables, beacons, proximity sensors, and smart home devices. Bluetooth 5.0+ features including extended range (4x), increased throughput (2x), and broadcast capacity. Direction finding for asset tracking and indoor positioning. Nordic Semiconductor, TI, and Cypress BLE solutions.
LoRaWAN & Long-Range Protocols Long-range, low-power wide-area network (LPWAN) for IoT applications requiring multi-mile range with minimal power. LoRaWAN networks in major US cities through providers like Senet, Helium, and private deployments. Sub-GHz ISM band (902-928 MHz in US) providing excellent building penetration. Alternative LPWAN: Sigfox (limited US deployment).
Zigbee & Thread for Mesh Networks Mesh networking protocols for smart home and building automation. Zigbee 3.0 (unified standard) for lighting, HVAC, and security systems—interoperability across manufacturers. Thread protocol (IPv6-based mesh) backed by major tech companies via Matter standard for smart home interoperability.
Industrial Protocols: Modbus, EtherNet/IP, Profinet Industrial communication protocols for factory automation and SCADA systems. Modbus RTU/TCP (widely deployed legacy protocol), EtherNet/IP (Rockwell Automation/ODVA standard dominant in North America), Profinet (Siemens, growing industrial Ethernet), and OPC UA (industry standard for Industry 4.0 interoperability).
Industrial IoT & Smart Manufacturing
Industry 4.0 & Smart Factory Solutions Digital transformation of US manufacturing through IoT sensor networks, predictive maintenance, real-time production monitoring, and digital twins. Integration with industrial equipment (PLCs, CNCs, robotics) collecting operational data. Edge computing for local processing and cloud connectivity for analytics.
Predictive Maintenance Systems Vibration monitoring, thermal imaging, current monitoring, and ultrasonic detection predicting equipment failure before downtime. Machine learning models analyzing sensor data identifying anomaly patterns. Integration with CMMS (Computerized Maintenance Management Systems) for work order automation. ROI through reduced downtime (15-30% typical) and extended equipment life.
Manufacturing Execution Systems (MES) Integration IoT connectivity to MES platforms tracking work-in-progress, quality data, and equipment status. Real-time production visibility and OEE (Overall Equipment Effectiveness) monitoring. Integration with ERP systems (SAP, Oracle, Microsoft Dynamics) for production planning and inventory management.
Supply Chain & Asset Tracking GPS and cellular tracking for fleet management, container tracking, and high-value asset monitoring. Geofencing, route optimization, and driver behavior monitoring. BLE beacons and RFID for warehouse and facility asset tracking. Integration with logistics platforms (Oracle Transportation Management, Blue Yonder, Manhattan Associates).
Energy Monitoring & Building Management Smart building solutions monitoring HVAC, lighting, occupancy, and energy consumption. BACnet protocol integration with building automation systems. Demand response programs participating in utility programs (reducing consumption during peak periods for incentives). LEED certification support and ENERGY STAR compliance.
Edge Computing & AI/ML Integration
NVIDIA Jetson for Edge AI AI inference at the edge using NVIDIA Jetson modules (Nano, Xavier NX, AGX Xavier, Orin). Computer vision applications for quality inspection, object detection, facial recognition, and autonomous systems. TensorRT optimization of neural networks for real-time performance. Deployed in manufacturing inspection, retail analytics, and robotics.
AWS IoT Greengrass & Azure IoT Edge Hybrid cloud-edge architectures using AWS IoT Greengrass or Azure IoT Edge. Local processing, ML inference, and data filtering at edge devices with cloud synchronization. Lambda functions (AWS) or modules (Azure) deployed to edge devices. Offline operation with automatic cloud sync when connectivity restored.
TensorFlow Lite & Edge Impulse Optimized ML models for microcontrollers and edge devices. TensorFlow Lite for Microcontrollers running on ARM Cortex-M4/M7. Edge Impulse platform for developing, training, and deploying ML models to embedded devices. Applications: keyword spotting, gesture recognition, anomaly detection, and sensor fusion.
Computer Vision at the Edge Real-time image processing for industrial inspection, retail analytics, security, and autonomous systems. OpenCV optimization for embedded Linux and dedicated hardware accelerators. Integration with industrial cameras (Basler, FLIR, Allied Vision) using GigE Vision, USB3 Vision, or CoaXPress.
Consumer IoT & Smart Home
Matter/Thread Smart Home Integration Development for Matter standard (formerly Project CHIP) providing interoperability across Apple HomeKit, Google Home, Amazon Alexa, and Samsung SmartThings. Thread mesh networking with border router connectivity. Simplified commissioning and local control improving reliability.
Amazon Alexa & Google Assistant Integration Voice-controlled IoT devices integrating with Alexa Voice Service (AVS) or Google Assistant SDK. Custom Alexa Skills and Google Actions for device-specific functionality. Works with Alexa and Works with Google certification programs.
Wearable Devices & Fitness Trackers Custom wearable development for health monitoring, fitness tracking, and personal safety. Sensor integration: accelerometer, gyroscope, heart rate (PPG), SpO2, temperature, and GPS. Mobile app connectivity via BLE for data sync and configuration. FDA considerations for health monitoring features.
Smart Appliances & Home Automation Connected appliances (refrigerators, washing machines, thermostats) and home security systems. UL safety certification, energy efficiency compliance (ENERGY STAR), and cybersecurity (UL 2900). Integration with utility demand response programs.
USA Regional IoT & Hardware Expertise
Silicon Valley: Electronics Innovation Heritage Legacy of semiconductor and electronics innovation from HP, Intel, Apple, and countless startups. Dense ecosystem of PCB designers, contract manufacturers, component distributors (Arrow Electronics, Avnet), and venture capital. Highest costs ($150,000-250,000 for senior embedded engineers) but deepest talent pool and fastest prototyping resources.
Austin: Semiconductor & Manufacturing Hub "Silicon Hills" with semiconductor companies (NXP, Silicon Labs, AMD), manufacturing (Flex, Foxconn), and technology giants (Apple, Tesla). Lower costs than Bay Area ($110,000-180,000) with strong technical talent from UT Austin. Growing IoT ecosystem and smart city initiatives.
Boston: Robotics & Advanced Manufacturing Robotics innovation (Boston Dynamics, iRobot heritage) and advanced manufacturing. MIT and Harvard research partnerships for cutting-edge embedded systems and AI/ML. Medical device expertise (FDA regulatory) and defense contractors (ITAR compliance). Strong in computer vision and autonomous systems.
Seattle: Aerospace & Industrial IoT Boeing aerospace engineering heritage and Amazon IoT platform development. Expertise in high-reliability systems, industrial IoT, and cloud-connected devices. Microsoft presence driving Windows IoT and Azure IoT Edge development.
Midwest Manufacturing Belt (Detroit, Milwaukee, Chicago) Automotive electronics (Detroit), industrial automation (Milwaukee), and manufacturing IoT. Expertise with ruggedized devices, automotive qualification (AEC-Q standards), and factory floor connectivity. Cost-effective engineering resources ($90,000-150,000) with deep manufacturing domain knowledge.
IoT Security & Cybersecurity
Secure Boot & Firmware Authentication Hardware root of trust ensuring only authenticated firmware executes on devices. ARM TrustZone, secure boot implementations, and cryptographic signature verification. Protection against firmware tampering and unauthorized modifications. Critical for devices in critical infrastructure and regulated industries.
Over-the-Air (OTA) Firmware Updates Secure OTA update mechanisms for remote firmware patches and feature updates. Encrypted update packages, rollback protection, and update authentication. Cloud-based update management (AWS IoT Device Management, Azure Device Update) or custom update servers. Field update capability critical for security patch deployment.
UL 2900 Cybersecurity Certification Network-connectable product cybersecurity certification addressing software vulnerabilities, malware protection, authentication, and secure updates. UL 2900-1 (general requirements), 2900-2-2 (healthcare), 2900-2-3 (industrial control systems). Increasingly required by enterprises and government procurement.
PKI & Certificate Management Public key infrastructure for device identity and secure communications. X.509 certificates provisioned during manufacturing, secure storage in hardware security modules (HSM) or secure elements. Certificate lifecycle management and renewal automation.
Hardware Technology Stack
Microcontrollers & SoMs - ARM Cortex-M: STM32, NXP Kinetis, TI MSP432, Microchip SAM - RISC-V: SiFive, ESP32-C3 (emerging open-source architecture) - System-on-Modules: Raspberry Pi CM4, NVIDIA Jetson, Toradex - MCU with Wireless: ESP32 (WiFi/BLE), Nordic nRF52/nRF53 (BLE)
Connectivity Modules - Cellular: Telit, Sierra Wireless, Quectel, u-blox (Cat-M1, NB-IoT, 4G/5G) - WiFi: Espressif ESP32, Qualcomm, Broadcom, TI CC3200 - BLE: Nordic Semiconductor, TI CC2640, Cypress - LoRaWAN: Semtech SX1276/SX1262, Microchip RN2903
Development Tools - PCB Design: Altium Designer, KiCad, Autodesk Eagle - Embedded IDE: STM32CubeIDE, IAR, Keil, Segger Embedded Studio - Simulation: LTspice (analog), MATLAB/Simulink (control systems) - Debug: JTAG/SWD debuggers (J-Link, ST-Link)
Cloud IoT Platforms - AWS IoT Core: MQTT messaging, device shadows, rules engine - Azure IoT Hub: Device twins, edge integration, digital twins - Google Cloud IoT: Device management, Pub/Sub integration - ThingWorx: Industrial IoT platform (PTC)
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Get Started TodayFrequently Asked Questions
FCC certification for wireless devices (Part 15 intentional radiators) requires: (1) Pre-compliance Testing: In-house or consultant testing using spectrum analyzers and RF test equipment identifying issues early ($5,000-20,000 in equipment or consultant services); (2) Certification Testing: Accredited test lab (Intertek, UL Solutions, TÜV) testing radiated emissions, conducted emissions, power output, and bandwidth ($3,000-15,000 depending on complexity); (3) FCC ID Application: Filing with FCC including test reports, photos (internal/external), user manual, and operational description ($4,000-8,000 including TCB review fee); (4) Certification Modules: Alternative is using pre-certified wireless modules (ESP32, Nordic BLE, cellular modules) qualifying for modular approval—simpler path but less design flexibility. Timeline: 3-8 weeks after test lab submission. Must also comply with carrier requirements (AT&T, Verizon certification) for cellular devices adding 2-6 months. Budget $10,000-30,000 total for FCC certification of custom wireless design.
IoT product development costs vary dramatically by complexity: Development Phase: (1) Industrial design and mechanical engineering: $25,000-100,000; (2) PCB design and embedded firmware: $50,000-200,000; (3) Regulatory compliance (FCC, UL): $15,000-50,000; (4) Tooling for injection molding: $5,000-50,000 per part. Total NRE (non-recurring engineering): $100,000-500,000+ for complex devices. Manufacturing Costs: USA PCBA assembly $5-50 per board depending on complexity, Asia manufacturing 30-50% less but with lead time, IP, and quality trade-offs. Enclosure/final assembly adds $2-20 per unit. Low-volume (1,000 units): $50-200 per device. High-volume (100,000+): $10-50 per device through economies of scale. Ongoing costs: Cloud services ($0.10-5 per device/month), cellular connectivity ($2-10/device/month for Cat-M1/NB-IoT), warranty/support.
US cellular IoT network selection depends on application requirements: AT&T offers nationwide LTE-M (Cat-M1) and NB-IoT coverage, strong enterprise support, and IoT-specific data plans ($2-6/device/month for low-data applications). AT&T retiring 3G (completed 2022) means all devices must be LTE or 5G. Verizon provides extensive LTE-M coverage (deployed across entire 4G network), ThingSpace IoT platform for device management, and premium network reliability. Pricing similar to AT&T. T-Mobile has growing LTE-M network (nationwide coverage achieved 2020+), aggressive IoT pricing, and 5G expansion. Acquired Sprint's spectrum strengthening coverage. For multi-carrier redundancy, dual-SIM designs or eSIM with carrier switching. MVNOs (Twilio, Particle, Hologram) provide multi-carrier SIMs switching between networks for coverage redundancy—premium pricing but simplified management. NB-IoT has limited adoption vs. LTE-M in USA—prioritize LTE-M for new designs. 5G IoT for high-bandwidth, low-latency applications (industrial automation, autonomous vehicles).
Connectivity selection based on range, power, bandwidth, and cost requirements: WiFi (802.11): Best for high-bandwidth (video, frequent data), AC-powered devices, existing infrastructure (smart home, industrial with WiFi). Range: 100-300 ft indoors. Power: not suitable for battery. Cost: $2-10 module. Bluetooth Low Energy: Best for short-range (wearables, proximity beacons, sensor networks with gateway). Range: 30-300 ft. Power: coin cell battery for months/years. Cost: $1-5 module. LoRaWAN: Best for long-range, low-bandwidth (sensor data every 15+ minutes), battery-powered over years. Range: 2-10+ miles. Power: AA battery for 5-10 years possible. Cost: $5-15 module + network fees ($1-10/device/year). Limited US network deployment vs. Europe. Cellular (LTE-M/NB-IoT): Best for wide-area coverage without infrastructure, moderate data, critical applications. Range: miles (cellular tower coverage). Power: battery life measured in days-months. Cost: $10-30 module + $2-10/device/month data. Choose cellular for deployed assets (vehicles, remote sensors), LoRaWAN for rural/agricultural IoT, BLE for consumer products, WiFi for high-bandwidth stationary devices.
Consumer IoT: Emphasizes cost optimization, aesthetics, ease-of-use, and rapid time-to-market. Target retail price points ($20-200 for mass market), plastic injection molded enclosures with attractive industrial design, mobile app as primary interface, and consumer-grade reliability (90-95%). Certifications: FCC, UL (optional for many consumer products), FTC compliance. Volumes: 10,000-1M+ units. Connectivity: WiFi, BLE, cellular. Industrial IoT: Prioritizes reliability, ruggedness, longevity, and integration with industrial systems. Higher price points acceptable ($200-5,000+), metal enclosures with NEMA ratings (IP65-IP67), DIN rail mounting, wide operating temperature (-40°C to +85°C), industrial protocols (Modbus, EtherNet/IP, OPC UA), and 99%+ uptime requirements. Certifications: UL industrial, hazardous location if needed, longer support lifecycle (10+ years vs. 2-3 years consumer). Volumes: 100-10,000 units. Development costs higher for industrial (ruggedization, certifications, longer qualification) but margins support investment.
UL (Underwriters Laboratories) certification is not legally required for most products but is often necessary for market access and liability protection. When UL is Required: Many retailers (especially big-box stores) require UL listing, commercial buildings often require UL for installed equipment, government procurement typically mandates UL, and insurance companies may require UL for fire/electrical coverage. UL Standards for IoT: UL 2089 (standard for IoT devices), UL 60950-1 (IT equipment, being replaced by UL 62368-1), UL 2900 series (cybersecurity for network-connectable products). Process: Submit samples to UL, testing for electrical safety (shock hazard, fire risk, insulation), mechanical safety, and environmental testing (temperature, humidity). Cost: $5,000-25,000 for initial testing/listing, annual follow-up fees ($1,000-5,000), and quarterly factory inspections. Timeline: 6-12 weeks for testing. Alternatives: CE marking (Europe), FCC (wireless only, doesn't address safety), or no certification for B2B products with contractual liability protections. Consumer products and grid-connected devices strongly benefit from UL listing.
Top US markets for embedded/hardware engineering: Silicon Valley/San Francisco Bay Area dominates with deepest talent pool from semiconductor heritage (Intel, AMD, NVIDIA), Apple, and countless hardware startups—highest salaries ($150,000-250,000 for senior embedded/hardware engineers) but unmatched expertise especially for consumer electronics, wireless design, and complex systems. Austin offers strong semiconductor industry (NXP headquarters, AMD, Samsung foundry), contract manufacturing presence, and UT Austin engineering pipeline at lower costs ($110,000-180,000). Boston excels in robotics, medical devices, and defense applications with MIT/Harvard talent pipeline ($120,000-200,000). Seattle provides aerospace and high-reliability systems expertise with Boeing heritage. San Diego strong in wireless/RF engineering (Qualcomm influence) and defense contractors. Portland offers semiconductor presence (Intel), lower costs, and lifestyle appeal. Phoenix growing with semiconductor manufacturing (Intel, TSMC investment). For cost-sensitive projects, consider Midwest (Detroit for automotive electronics $90,000-150,000) or nearshore options (Mexico for manufacturing proximity, Eastern Europe for design). Hardware development still benefits from in-person collaboration for prototyping/testing—fully remote less common than software development.
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